Glass wafer processing

Ion-Exchange technology platform

Teem’s Photonics Integrated Platform is based on Ion-Exchange and standard metal layers deposition and photolithography technologies. After wafer cutting and polishing steps, a metallic layer is deposed on its surface. Micron-size windows with desired designs are opened in the metallic layer thanks to a photolithography step. A two-steps ion-exchange process is implemented to create the waveguides close to the glass surface. The glass wafer is then diced into several chips. The final steps are glass chip pigtailing with ferules or fibre array units and packaging.

Waveguide manufacturing Process

The waveguide manufacturing process is divided into two steps. The first one consists in introducing Ag+ ions into the glass wafer close to its surface. It is carried out by diping the glass wafer in a molten bath containing silver nitrate at high temperatures (300-400°C). The second step buries the waveguide thanks to an electric current. The goal is to remote the waveguide from the glass surface to minimize the waveguide propagation losses.

Back