In the past years, Silicon photonics (Si-Ph) have captured the forefront of Telecom photonics applications in particular for datacenters and interconnects thanks to a compact and highly scalable solution.
One of the main downside of the high-confinment feature of silicon waveguides is the interfacing with optical fibre. This interface is even more tricky when dealing with multi-channel components.
Edge Coupling Transposer
Top Coupling Transposer
Teem photonics offers the ioNext photonics integration with innovative and competitive solutions for silicon photonics and III-V chip-to-fiber optical interfacing. Based on our highly-scalable optical waveguides manufacturing platform on glass and a fiber spacing concentrator (FSC) optical design, our interface components are compact and innately adapted to multi-channel applications (up to 256).
Our WAFT (Waveguide Array to Fiber Transposer) device is a smart combination of FSC and array of Mode Field Diameter (MFD) converters. The FSC offers a reduction of the fiber pitch when the mode converter allows reducing the mode field diameter from the one of a standard fiber to a tigher one. The WAFT is dedicated to edge coupling architectures for high optical bandwidth and highest coupling efficiency.
WAFT provides the highest fiber-to-chip coupling efficiency with a compact and cost-effective approach based on our ioNext Platform on glass.
We can offer output mode size as low as 4 x 3µm, optical pitch as low as 10µm and optical ports number as high as 256.
Chip shaping options are also available to reduce the glass chip footprint.
Our new WAFT-based solutions for top coupling architectures are fully compatible with standard grating couplers. The FSC-TC devices offer a reduced interfacing and packaging footprint compared to direct fiber array coupling configurations.